| DESCRIPTION: |
| UltraStrip 216 Resist Stripping System is designed to strip fully-aqueous dry film photoresists from printed circuit boards. Its unique blend of components promotes a high strip rate, easily filterable particles, and complete removal of dry film residues and adhesion promoters, even under overplated circuits. UltraStrip 216 contains no caustic, so it will not attack copper, tin or tin-lead. It has a powerful anti-tarnish package to prevent copper oxidation. UltraStrip 216 does not contain glycol ethers or any other solvent. FEATURES & BENEFITS: UFeaturesU UBenefit Fast stripping rate Contains no caustic Solvent free Uniform strip rate Clean, untarnished copper left Breaks most film into particles Minimal odor Embedded defoamer PHYSICAL & CHEMICAL PROPERTIES: Appearance Odor Flash Point Freezing Temperature Storage Temperature pH High line speeds No tin or copper attack Ease of waste treatment Easy, consistent operation No interference with clean etching Easy filtration to lengthen bath life No complaints about “dead fish” smell Reduced or eliminated defoamer adds Clear to pale yellow solution Slight amine 250O F 5O F 100O F maximum 12.9 |
KT Florida Cirtech 